System in Package

System in Package

A System in Package (SiP) is a number of integrated circuits enclosed in a single module and
to provide higher integration solutions , modulization is a trend and SiP plays more important role in this high
matrix market. MEGA has developed embedded SSD using SiP technology that provides improved
performance and shrinking the size of board level SSD module.

System in Package and Shrink

MEGA's SiP technology is an ideal solution for embedded SSD module that demand smaller size with increased functionality.

  • Smaller size solution than board level SSD module
  • Higher performance through shorter interconnect paths and embedded shielding
  • Lower overall cost
  • Higher Reliability performance for vibration , moisture and dust environments