BGA SSD Integration

For application of embedded system, SSDs have to meet requirements such as
smaller and lighter , vibration , water and dust proof. MEGA Electronics offers embedded SSDs which
has MO297(JEDEC) standard specification to SATA SSD , fully integrated in BGA package including NAND flash and controller
die using SiP (System in Package) technology. Whether you’re buying an embedded SSD for your small embedded
system , MEGA Electronics is always best choice for your needs and budget.

Application Field

  • Smart Car

  • Military

  • Mobile Device

  • Drone Camera

  • Car Black Box

  • Embedded Board

BGA SSD Specifications

Features
Host Interface : SATA3 6Gb/s, PCIe/NVMe
Form Factor : 20x16x1.5mm(L x W x H)
Package Type : BGA
Industry Standard : JEDEC MO-276 / PCI-SIG
EMI Attenuation : Up to 20dB
Density
64GB/128GB/256GB/512GB/1TB
Performance
Seq Read : Up to 2500 MB/s
Seq Write : Up to 1800 MB/s
Reliability
Operating Temperature : 0℃ ~ +70℃
- Standard Grade : 0℃ ~ +70℃
- Industrial Grade : -40℃ ~ +85℃
Storage Temperature : -40℃ ~ +85℃
Shock : 1500G / 0.5ms
Vibration : 20G
This product is currently under development and it will tape out 2021